Various side-channel attacks (SCAs) on ICs have been successfullydemonstrated and also mitigated to some degree. In the context of 3D ICs,however, prior art has mainly focused on efficient implementations of classicalSCA countermeasures. That is, SCAs tailored for up-and-coming 3D ICs have beenoverlooked so far. In this paper, we conduct such a novel study and focus onone of the most accessible and critical side channels: thermal leakage ofactivity and power patterns. We address the thermal leakage in 3D ICs early onduring floorplanning, along with tailored extensions for power and thermalmanagement. Our key idea is to carefully exploit the specifics of material andstructural properties in 3D ICs, thereby decorrelating the thermal behaviourfrom underlying power and activity patterns. Most importantly, we discusspowerful SCAs and demonstrate how our open-source tool helps to mitigate them.
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